Novel Electro-treatment of Metallic Materials
Dislocation generation in pure Sn strips during electro-treatment
(C.C. Shu, C.L. Liang* et al., Mater. Sci. Eng. A 772 (2020) 138689)
Strain accumulation in pure Al thin films during electro-treatment
(C.L. Liang* et al., Thin Solid Films 636 (2017) 164)
In-grain misorientation evolution in pure Al foils during electro-treatment
(P.C. Ku, C.L. Liang* et al., Mater. Charact. 174 (2021) 110980)
In situ crystallinity decline in pure Sn strips during electro-treatment
(Y.H. Liao, C.H. Chen, C.L. Liang* et al., Acta Mater. 200 (2020) 200)
Interfacial Reaction and Surface Engineering
Elemental mappings at solder/Au/Pd/Cu interfaces after solid-state aging
(C.L. Liang* et al., J. Mater. Sci. 52 (2017) 11659)
Microstructure evolutions at solder/metallization interfaces after solid-state aging
(C.L. Liang* et al., Surf. Coat. Technol. 319 (2017) 55)
Bonding interfaces and IMCs in novel TCNCP solder joints
(C.L. Liang* et al., J. Electron. Mater. 45 (2016) 51)
Lattice structure characterization of the bilayer Cu6Sn5-based IMCs
(C.L. Liang* et al., J. Mater. Sci. Mater. Electron. 29 (2018) 15233)
Advanced Electronic Packaging Materials and Technology
Cu protrusion inhibition in TSVs by nanotwinned-Cu application
(T.C. Lin, C.L. Liang* et al., Scr. Mater. 197 (2021) 113782)
In situ electromigration behavior in novel Cu tall pillar/Cu via interconnects
(C.L. Liang* et al., 71st IEEE ECTC, 2021 June)
Electromigration-induced failure in advanced fine-pitch Cu RDLs for FOCoS packaging
(C.L. Liang* et al., Mater. Chem. Phys. 256 (2020) 123680)
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