49. Yi-Chen Keng, Kuan-Ju Shao, Meng-Chun Chiu, Jui-Yi Hu, Chien-Lung Liang*, Min-Yan Tsai, Yung-Sheng Lin, Chen-Chao Wang, Chih-Pin Hung, Kwang-Lung Lin**, “A Study of Electromigration Behavior, Reliability, and Failure Mechanisms in Novel 3D Cu Microvia Interconnects for Advanced Fan-out Packaging,” 2025 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2025. Oral presentation
48. Meng-Chun Chiu, Chih-An Wu, Yi-Chen Keng, I-Hsien Chen, Chien-Lung Liang*, “Comparative spheroidization of S50C medium-carbon steels by electrical and subcritical heat treatments: Microstructure-property correlations and mechanisms,” 2025 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2025. Oral presentation
47. Hsin-Yu Peng, Hao-Yu Chen, Shih-Yu Huang, Chien-Lung Liang*, “Electromigration-driven Polarity Effect on Intermetallic Growth Kinetics under in Cu-37Zn/Sn/Cu-37Zn Solder Joints: An EBSD Study,” 2025 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2025. Oral presentation
46. Hao-Yu Chen, Hsin-Yu Peng, Shih-Yu Huang, Chien-Lung Liang*, “Effect of Electromigration on Interfacial Reaction and Intermetallic Compound Evolution in Cu-45Ni/Sn/Cu-45Ni Pb-free Solder Joints,” 2025 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2025. Oral presentation
45. Meng-Chun Chiu, Chih-An Wu, Le Charng, Li-Yung Tseng, Chien-Lung Liang*, Effects of Electro-spheroidization on Mechanical and Corrosion Behaviors in S50C Medium-carbon Steels,” 2025 Materials Research Society-Taiwan (MRS-T), Hsinchu, Taiwan, November 2025. Poster presentation
44. Hsin-Yu Peng, Hao-Yu Chen, Shih-Yu Huang, Chien-Lung Liang*, “Electromigration-induced Interfacial Reaction and Intermetallic Evolution in Cu-37Zn/Sn/Cu-37Zn Pb-free Solder Joints,” 2025 Materials Research Society-Taiwan (MRS-T), Hsinchu, Taiwan, November 2025. Poster presentation
43. Yi-Chen Keng, Kuan-Ju Shao, Meng-Chun Chiu, Jui-Yi Hu, Chien-Lung Liang*, Min-Yan Tsai, Yung-Sheng Lin, Chen-Chao Wang, Chih-Pin Hung, Kwang-Lung Lin**, “An Electromigration Study of Novel 3D Cu Microvia Interconnects for Advanced High-density Fan-out Packaging,” 2025 University Academic Alliance in Taiwan (UAAT)-Kyushu Okinawa Open University (KOOU) Advanced Semiconductor Packaging Workshop, Taipei, Taiwan, October 2025. Oral presentation
42. Meng-Chun Chiu, Yu-Chun Liu, Min-Yan Tsai, Shan-Bo Wang, Yung-Sheng Lin, Chien-Lung Liang*, “Electromigration of FCQFN Ag-plated Cu Pillar Solder Interconnects for High-power Automotive Packaging: Effects of Ni Metallization on Interfacial Reaction and Electrical Performance,” 2025 University Academic Alliance in Taiwan (UAAT)-Kyushu Okinawa Open University (KOOU) Advanced Semiconductor Packaging Workshop, Taipei, Taiwan, October 2025. Oral presentation
41. Meng-Chun Chiu, Chien-Lung Liang*, “Electro-spheroidization Effects on Mechanical Properties in S50C Medium-carbon Steels: A Comparison with Conventional Subcritical Spheroidization,” 2025 College Student Research Competition in Department of Materials Science and Engineering at National Taiwan University of Science and Technology, Taipei, Taiwan, September 2025. Oral presentation
40. U-Wei Chen, Chien-Lung Liang*, “A Study of the Dissolution and Precipitation Behaviors of Mg17Al12 in AZ91 Magnesium Alloys Induced by Electro-treatment,” 2025 College Student Research Competition in Department of Materials Science and Engineering at National Taiwan University of Science and Technology, Taipei, Taiwan, September 2025. Oral presentation
39. Meng-Chun Chiu, Chih-An Wu, Chien-Lung Liang*, “Effects of Electro-spheroidization on Mechanical and Corrosion Behaviors in S50C Medium-carbon Steels: A Comparative Study with Conventional Subcritical Spheroidization Annealing,” 2025 Chinese Institute of Engineers Student Engineering Paper Competition, Hsinchu, Taiwan, July 2025. Poster presentation
38. I-Hsien Chen, Meng-Chun Chiu, Chien-Lung Liang*, “Athermally-enhanced Recovery and Recrystallization Behaviors in Cold-rolled Pure Tungsten via Electric Current Stressing,” 2025 Chinese Institute of Engineers Student Engineering Paper Competition, Hsinchu, Taiwan, July 2025. Poster presentation
37. Yu-Chun Liu, Min-Yan Tsai, Meng-Chun Chiu, Shan-Bo Wang, Yung-Sheng Lin, Chien-Lung Liang*, “Characterization of FCQFN Solder Interconnects Incorporating Ni Metallization for Advanced High-power Automobile Applications: An Electromigration Study,” 2025 154th The Minerals, Metals & Materials Society (TMS) Annual Meeting, Las Vegas, Nevada, USA, March 2025. Oral presentation
36. Meng-Chun Chiu, Min Ku, Hsuan-Cheng Huang, Chien-Lung Liang*, “Electro-recrystallization Behavior in Cold-rolled Nickel-chromium Alloys under Direct Current Stressing,” 2025 154th The Minerals, Metals & Materials Society (TMS) Annual Meeting, Las Vegas, Nevada, USA, March 2025. Oral presentation
35. Yao-Lun Cheng, Jen-Ting Wang, Meng-Chun Chiu, Yung-Hua Chen, Chien-Lung Liang*, “Development of a Novel Processing Technique for Cold-rolled 2014 Aluminum Alloys via Athermally-enhanced Electrical Annealing,” 2025 154th The Minerals, Metals & Materials Society (TMS) Annual Meeting, Las Vegas, Nevada, USA, March 2025. Oral presentation
34. Chih-An Wu, Meng-Chun Chiu, Jau-Chi Chen, Yung-Hua Chen, Chien-Lung Liang*, “Effects of Current-assisted Treatment on the Microstructure, Mechanical Property, and Corrosion Behavior of Cu-8 wt% Sn alloys in a Chloride Environment,” 2025 154th The Minerals, Metals & Materials Society (TMS) Annual Meeting, Las Vegas, Nevada, USA, March 2025. Oral presentation
33. Yu-Chun Liu, Meng-Chun Chiu, Shan-Bo Wang, Min-Yan Tsai, Yung-Sheng Lin, Chien Lung Liang*, “Effects of Ni and Ag Metallizations on Electromigration Reliability in FCQFN Solder Interconnects for High-Power Automotive Applications,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
32. I-Hsien Chen, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Athermally-enhanced Recovery and Recrystallization Behaviors in Cold-rolled Pure Tungsten via Electric Current Stressing,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
31. Chun-Liang Chen, Chih-Chao Liang, Sheng-Fu Yang, Chien-Lung Liang*, “A Study of Promising Material Processes to Recycle Industrial Aluminum Dross to Sustainable Activated Alumina,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
30. Jen-Ting Wang, Yung-Hua Chen, Yao-Lun Cheng, Meng-Chun Chiu, Chien-Lung Liang*, “Effects of Electro-treatment on the Microstructure and Precipitate Evolutions in 2024 Aluminum Alloys,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
29. Jie-Fu Chen, Meng-Chun Chiu, Hsuan-Cheng Huang, Pao-Hsuan Yang, Yung-Hua Chen, Chien-Lung Liang*, “A Study of the Electrical Annealing and Creep Behavior in Pure Aluminum Induced by Electro-treatment,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
28. Meng-Chun Chiu, Min Ku, Hsuan-Cheng Huang, Chien-Lung Liang*, “Effects of Electro-treatment on the Annealing Behavior in Cold-rolled Nickel-chromium Alloy Foils,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
27. Yung-Hua Chen, Chih-An Wu, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Current-induced Recrystallization Behavior and Changes in Mechanical Strength and Corrosion Resistance in cold-rolled Al-3Mg Alloys,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
26. Jau-Chi Chen, Hsuan-Cheng Huang, Chih-An Wu, Su-Chen Liao, Meng-Chun Chiu, Chien-Lung Liang*, “Effects of Electro-treatment on the Annealing Behavior, Mechanical Strength, and Corrosion Resistance in Cold-rolled Cu-45 wt% Ni Alloy Foils,” 2024 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2024. Oral presentation
25. Chun-Liang Chen, To-Mei Wang, Yu-Ren Chen, Sheng-Fu Yang, Chien-Lung Liang*, “Activation Process Development of Sustainable Adsorbent Materials from Alumina Dross,” 2024 13th International Conference on Material Science and Engineering Technology (ICMSET), Nagoya, Japan, November 2024. Oral presentation
24. Yu-Chun Liu, Min-Yan Tsai, Meng-Chun Chiu, Shan-Bo Wang, Yung-Sheng Lin, Chien-Lung Liang*, “Effects of Ni Metallization on the Interfacial Reaction and Electromigration Reliability of Ag-plated FCQFN Cu Pillar Solder Interconnects for Advanced High-power Automobile Applications,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
23. I-Hsien Chen, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Effects of Electro-treatment on the Recovery and Recrystallization Behaviors in Cold-rolled Pure Tungsten,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
22. Jen-Ting Wang, Yung-Hua Chen, Yao-Lun Cheng, Meng-Chun Chiu, Chien-Lung Liang*, “The Annealing and Precipitation behaviors in 2024 Aluminum Alloys induced by Electro-treatment,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
21. Chih-An Wu, Meng-Chun Chiu, Yung-Hua Chen, Jau-Chi Chen, Chien-Lung Liang*, “Athermally-enhanced Recrystallization in Cold-rolled Cu-8 wt% Sn Alloy via Electro-treatment: A Comprehensive Study of Microstructure, Mechanical Strength, and Corrosion Resistance,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
20. Yung-Hua Chen, Chih-An Wu, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “A Comprehensive Study of Electro-treatment of Al-3Mg Aluminum Alloys: Effects on Microstructure, Texture, Mechanical Property, and Corrosion Behavior,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
19. Jau-Chi Chen, Hsuan-Cheng Huang, Chih-An Wu, Su-Chen Liao, Meng-Chun Chiu, Chien-Lung Liang*, “The Microstructure, Mechanical Strength, and Corrosion resistance Evolutions in Cold-rolled Cu-45 wt% Ni Alloys Induced by Electro-treatment,” 2024 Materials Research Society-Taiwan (MRS-T), Taichung, Taiwan, November 2024. Poster presentation
18. Yu-Chun Liu, Shan-Bo Wang, Meng-Chun Chiu, Min-Yan Tsai, Yung-Sheng Lin, Chen-Chao Wang, Chih-Pin Hung, Chien-Lung Liang*, “Electromigration Failure Study of Advanced Flip-chip QFN Solder Interconnects with Various Metallization Combinations for High-power Automobile Applications,” 2024 19th International Microsystems,
Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, October 2024. Oral presentation
17. I-Hsien Chen, Chien-Lung Liang*, “Effects of Electro-treatment on the Recovery and Recrystallization Behaviors in Cold-rolled Pure Tungsten,” 2024 College Student Research Competition in Department of Materials Science and Engineering at National Taiwan University of Science and Technology, Taipei, Taiwan, September 2024. Oral presentation
16. Min Ku, Su-Chen Liao, Pao-Xuan Yang, Meng-Chun Chiu, Chien-Lung Liang*, “Effects of Electro-treatment on the Recrystallization Behavior in Cold-rolled Nickel-chromium Alloy Foils,” 2024 3rd Walsin Lihwa Technical Exchange Poster Competition, Taipei, Taiwan, May 2024. Poster presentation
15. Pao-Hsuan Yang, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Microstructure, Texture, and Properties Evolutions in Pure Nickel Metal under High-density Electric Current Stressing,” 2024 153rd The Minerals, Metals & Materials Society (TMS) Annual Meeting, Orlando, Florida, USA, March 2024. Oral presentation
14. Su-Chen Liao, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “Investigations of Current-Induced Grain Growth and Properties Variation in Pure Ag Metal under Extremely High Current Density,” 2024 153rd The Minerals, Metals & Materials Society (TMS) Annual Meeting, Orlando, Florida, USA, March 2024. Oral presentation
13. Hsuan-Cheng Huang, Meng-Chun Chiu, Pao-Hsuan Yang, Chien-Lung Liang*, “Electro-recrystallization in Pure Cu Metal Induced by Current Stressing: A Comprehensive Study of Microstructure, Crystallinity, and Properties,” 2024 153rd The Minerals, Metals & Materials Society (TMS) Annual Meeting, Orlando, Florida, USA, March 2024. Oral presentation
12. Meng-Chun Chiu, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “Athermally-enhanced Recrystallization Behavior in Cold-rolled Pure Fe Strips Induced by Novel Electro-treatment: A Comprehensive tudy of Microstructure, Texture, Crystallinity, and Mechanical Property,” 2024 153rd The Minerals, Metals & Materials Society (TMS) Annual Meeting, Orlando, Florida, USA, March 2024. Oral presentation
11. Pao-Hsuan Yang, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Effects of Electric Current Stressing on the Grain Growth Behavior in Pure Nickel: A Study of Microstructure, Texture, and Properties,” 2023 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2023. Oral presentation
10. Su-Chen Liao, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “Athermally-enhanced Grain Growth Behavior in Pure Silver under Extremely High Electric Current Stressing,” 2023 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2023. Oral presentation
9. Hsuan-Cheng Huang, Meng-Chun Chiu, Pao-Hsuan Yang, Chien-Lung Liang*, “Effects of Current-induced Recrystallization on the Microstructure and Properties of Pure Cu Strips,” 2023 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2023. Oral presentation
8. Meng-Chun Chiu, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “Electromigration in Advanced High-power Automobile Interconnects with Ni and Ag Metallizations at Solder/Cu Interfaces,” 2023 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2023. Oral presentation
7. Meng-Chun Chiu, Min-Yan Tsai, Shan-Bo Wang, Yung-Sheng Lin, Chien-Lung Liang*, “Electro-recrystallization in Cold-rolled Pure Fe with Athermally-enhanced Characteristics,” 2023 International Student Workshop on Materials Science and Engineering (ISWMSE), Virtual, December 2023. Oral presentation
6. Min-Hung Wu, Chien-Lung Liang*, “On The Precipitation Behavior of 7075 Aluminum Alloys Induced by Athermal Effects of Novel Electro-treatment: A Comparison Study with the Conventional T6 Artificial Aging Treatment,” 2023 College Student Research Competition in Department of Materials Science and Engineering at National Taiwan University of Science and Technology, Taipei, Taiwan, November 2023. Oral presentation
5. Pao-Hsuan Yang, Hsuan-Cheng Huang, Meng-Chun Chiu, Chien-Lung Liang*, “Athermally-enhanced Grain Growth in Cold-rolled Pure Ni Induced by Novel Electrical Annealing Treatment,” 2023 Materials Research Society-Taiwan International Conference (MRSTIC), Hsinchu, Taiwan, November 2023. Poster presentation
4. Su-Chen Liao, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “Effects of Extremely High Density of Current Stressing on the Grain Growth Behavior and Property Variations in Pure Silver,” 2023 Materials Research Society-Taiwan International Conference (MRSTIC), Hsinchu, Taiwan, November 2023. Poster presentation
3. Hsuan-Cheng Huang, Meng-Chun Chiu, Pao-Hsuan Yang, Chien-Lung Liang*, “The Microstructure, Texture, Crystallinity, and Properties Evolutions in Pure Cu Induced by Electric Current Stressing,” 2023 Materials Research Society-Taiwan International Conference (MRSTIC), Hsinchu, Taiwan, November 2023. Poster presentation
2. Meng-Chun Chiu, Hsuan-Cheng Huang, Pao-Hsuan Yang, Chien-Lung Liang*, “On the Electro-recrystallization in Cold-rolled Pure Fe with Athermally-enhanced Behavior,” 2023 Materials Research Society-Taiwan International Conference (MRSTIC), Hsinchu, Taiwan, November 2023. Poster presentation
1. Meng-Chun Chiu, Min-Yan Tsai, Shan-Bo Wang, Yung-Sheng Lin, Chien-Lung Liang*, “Applications of Ni and Ag Metallizations at the Solder/Cu Interfaces in Advanced High-power Automobile Interconnects: An Electromigration Study,” 2023 Taiwan Association for Coating and Thin Film Technology (TACT) International Thin Films Conference, Taipei, Taiwan, November 2023. Oral presentation