Conference Proceedings

Google scholar: https://scholar.google.com.tw/citations?user=AO0XSoUAAAAJ&hl=zh-TW&oi=ao

 

Total number：7；First or corresponding author number：6/7​

2024

7. Yu-Chun Liu, Shan-Bo Wang, Meng-Chun Chiu, Min-Yan Tsai, Yung-Sheng Lin, Chen-Chao Wang, Chih-Pin Hung, Chien-Lung Liang*, “Electromigration Failure Study of Advanced Flip-chip QFN Solder Interconnects with Various Metallization Combinations for High-power Automobile Applications,” 2024 19th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan 2024, pp. 219-222. [DOI]. Corresponding author

6. Chien-Lung Liang*, Yung-Sheng Lin, Min-Yan Tsai, Meng-Chun Chiu, Shan-Bo Wang, Chih-Pin Hung, Kwang-Lung Lin, “Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line during In Situ Electromigration,” 2024 IEEE International Conference on Electronics Packaging (ICEP), Toyama, Japan, 2024, pp. 1-2. [DOI] First author & corresponding author​

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2023

5. Min-Yan Tsai*, Chin-Li Kao, Shan-Bo Wang, Yung-Sheng Lin, Meng-Chun Chiu, Chien-Lung Liang**, “An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications,” 2023 IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2023, pp. 326-332. [DOI] Corresponding author

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2022​

4. Shan-Bo Wang, An-Hsuan Hsu, Chin-Li Kao, David Tarng, Chien-Lung Liang*, Kwang-Lung Lin, “Novel Ga Assisted Low-temperature Bonding Technology for Fine-pitch Interconnects,” 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022, pp. 330-334. [DOI] Corresponding author

 

2021

3. Chien-Lung Liang*, Min-Yan Tsai, Yung-Sheng Lin, I-Ting Lin, Sheng-Wen Yang, Min-Lung Huang, Jen-Kuang Fang, Kwang-Lung Lin, “The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging,” 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2021, pp. 327-333. [DOI] First author & corresponding author

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2020

2. Chien-Lung Liang*, Yung-Sheng Lin, Chin-Li Kao, David Tarng, Shan-Bo Wang, Yun-Ching Hung, Kwang-Lung Lin, “Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging,” 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 361-366. [DOI] First author & corresponding author

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2014

1. Jr-Wei Peng*, Yan-Siang Chen, Yi Chen, Jiang-Long Liang, Kwang-Lung Lin, Yuh-Lang Lee, “Removed Organic Solderability Preservative (OSPs) by Ar/O2 Microwave Plasma to Improve Solder Joint in Thermal Compression Flip Chip Bonding,” 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2014, pp. 1584-1589. [DOI]