Conference Proceedings
Google scholar: https://scholar.google.com.tw/citations?user=AO0XSoUAAAAJ&hl=zh-TW&oi=ao
Total number：6；First or corresponding author number：5/6
2024
6. Chien-Lung Liang*, Yung-Sheng Lin, Min-Yan Tsai, Meng-Chun Chiu, Shan-Bo Wang, Chih-Pin Hung, Kwang-Lung Lin, “Direct Observation of Void Nucleation and Growth in a 2-μm-Wide Cu Redistribution Line during In Situ Electromigration,” Proceedings of 2024 IEEE International Conference on Electronics Packaging (ICEP), Toyama, Japan. [DOI] First author & corresponding author
2023
5. Min-Yan Tsai*, Chin-Li Kao, Shan-Bo Wang, Yung-Sheng Lin, Meng-Chun Chiu, Chien-Lung Liang**, “An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications,” Proceedings of 2023 IEEE Electronics Packaging Technology Conference (EPTC), Singapore. [DOI] Corresponding author
2022
4. Shan-Bo Wang, An-Hsuan Hsu, Chin-Li Kao, David Tarng, Chien-Lung Liang*, Kwang-Lung Lin, “Novel Ga Assisted Low-temperature Bonding Technology for Fine-pitch Interconnects,” Proceedings of 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA. [DOI] Corresponding author
2021
3. Chien-Lung Liang*, Min-Yan Tsai, Yung-Sheng Lin, I-Ting Lin, Sheng-Wen Yang, Min-Lung Huang, Jen-Kuang Fang, Kwang-Lung Lin, “The Dynamic Behavior of Electromigration in a Novel Cu Tall Pillar/Cu Via Interconnect for Fan-out Packaging,” Proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA. [DOI] First author & corresponding author
2020
2. Chien-Lung Liang*, Yung-Sheng Lin, Chin-Li Kao, David Tarng, Shan-Bo Wang, Yun-Ching Hung, Kwang-Lung Lin, “Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging,” Proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA. [DOI] First author & corresponding author
2014
1. Jr-Wei Peng*, Yan-Siang Chen, Yi Chen, Jiang-Long Liang, Kwang-Lung Lin, Yuh-Lang Lee, “Removed Organic Solderability Preservative (OSPs) by Ar/O2 Microwave Plasma to Improve Solder Joint in Thermal Compression Flip Chip Bonding” Proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA. [DOI]